1. The process edge is designed on the short side.
2. Notch near the installation of components, cutting the board caused component damage.
3.PCB board is selected as TEFLON material, board thickness 0.8mm, the material is soft and easy to deformation.
4. PCB using V-carved and long slot design process transfer edge, due to the connection part of the width of only 3mm, the board and heavier crystal, socket and other cartridge components, reflow soldering PCB will break, in the cartridge sometimes there will be a broken transfer edge phenomenon.
5. PCB board thickness of only 1.6mm, the width of the board in the middle of the spinning cloth power modules and coils and other heavy components, over the wave crest is easy to turn the tin phenomenon.
6. PCB with BGA components installed using the yin and yang design.
There are heavier components using the yin and yang board design to cause PCB deformation.
Installation of BGA package components PCB using yin and yang splicing design resulting in BGA solder joints are not reliable.
Shaped board, not made to splice board compensation, law into the equipment, the need for tooling, increasing manufacturing costs.
Four splicing board all use stamp hole way splicing, splicing board strength is low, easy to deformation.
Zhejiang NeoDen Technology Co., Ltd. has been manufacturing and exporting various small pick and place machines since 2010. Taking advantage of our own rich experienced RD, well trained production, NeoDen wins great reputation from the world wide customers.
With global presence in over 130 countries, the excellent performance, high accuracy and reliability of NeoDen PNP machines make them perfect for RD, professional prototyping and small to medium batch production. We provide professional solution of one stop SMT equipment.